Alinx Electronic Limited
AXU9EGB Dev Board & Kit with AMD Zynq US+ MPSoC ZU9EG
System-on-Module ● AMD/Xilinx Zynq Ultrascale+ MPSoC: ◆ ARM quad-core Cortex -A53 up to 1.3 GHz ◆ ARM dual-core Cortex -R5 up to 533 MHz ◆ Mali-400MP2 GPU ◆ 16nm FinFET+ FPGA fabric ● Pluggable module with 4 x Panasonic board-to-board connectors ● 4 GByte (64-bit) DDR4 SDRAM on PS ● 2 GByte (32-bit) DDR4 SDRAM on PL ● 64 MB QSPI Flash ● 8 GB eMMC Flash Base Board ● 1 x FMC HPC Connectors (36 pairs lvds ios + 8 pairs GTH) ● 2 x SFP+ Slots (per line 12.5Gbps) ● 2 x Gigabit Ethernet (1 x PS + 1 x PL) ● 2 x UART (1 x PS + 1 x PL)(USB to UART) ● 1 x M.2 Interface on PS ● 1 x DP Interface on PS ● 1 x 2 lane MIPI on PL ● 2 x CAN on PS ● 2 x RS485 Interfaces (1 x PS + 1 x PL) ● 2 x USB3.0 on PS + 2 x USB2.0 on PS ● 1x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.) ● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75) ● 1 x Micro SD ● 1 x RTC (Real-time clock) ● LED (1 x pwr + 1 x done + 1 x PL) + KEY (1 x RST + 1 x PS + 1 x PL) ● 12V single supply ● Dimensions: 180 x 135 mm form factor
Artikelnummer VAR-827002848
Hersteller-Teilenummer: AXU9EGB
Taric/custom code: 8471 8000 00 0
Artikel befindet sich in und wird versendet von: Riedlingen, Deutschland
The AXU9EGB/15EGB development board equipped with the AMD/Xilinx Zynq UltraScale+ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, FMC HPC, DP, M.2. Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provide high-speed communication (SFP+), high-speed storage (M.2) and video applications (DP).
Art.-ID | 102408 |
Zustand | Neu |
Modell | AXU9EGB |
Hersteller | Alinx Electronic Limited |
Herstellungsland | China |
Inhalt | 1 Stück |
Gewicht | 1000 g |
Netto-Gewicht | 1000 g |
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing