Alinx Electronic Limited

AXU9EGB Dev Board & Kit with AMD Zynq US+ MPSoC ZU9EG

System-on-Module ● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC: ◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz ◆ ARM® dual-core Cortex™-R5 up to 533 MHz ◆ Mali-400MP2 GPU ◆ 16nm FinFET+ FPGA fabric ● Pluggable module with 4 x Panasonic board-to-board connectors ● 4 GByte (64-bit) DDR4 SDRAM on PS ● 2 GByte (32-bit) DDR4 SDRAM on PL ● 64 MB QSPI Flash ● 8 GB eMMC Flash Base Board ● 1 x FMC HPC Connectors (36 pairs lvds ios + 8 pairs GTH) ● 2 x SFP+ Slots (per line 12.5Gbps) ● 2 x Gigabit Ethernet (1 x PS + 1 x PL) ● 2 x UART (1 x PS + 1 x PL)(USB to UART) ● 1 x M.2 Interface on PS ● 1 x DP Interface on PS ● 1 x 2 lane MIPI on PL ● 2 x CAN on PS ● 2 x RS485 Interfaces (1 x PS + 1 x PL) ● 2 x USB3.0 on PS + 2 x USB2.0 on PS ● 1x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.) ● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor (LM75) ● 1 x Micro SD ● 1 x RTC (Real-time clock) ● LED (1 x pwr + 1 x done + 1 x PL) + KEY (1 x RST + 1 x PS + 1 x PL) ● 12V single supply ● Dimensions: 180 x 135 mm form factor


Item number VAR-827002848


Possible to order. Out of Stock, restocking in progress
Expected dispatch delay beyond available stock: 1 week

Located in: Germany


EUR 1,506.90 *
Content 1 piece

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The AXU9EGB/15EGB development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, FMC HPC, DP, M.2. Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provide high-speed communication (SFP+), high-speed storage (M.2) and video applications (DP).

Item ID 102408
Condition New
Legacy item ID
Model AXU9EGB
Manufacturer Alinx Electronic Limited
Manufacturing country China
Content 1 piece
Weight 1000 g
Net weight 1000 g
Customs tariff number 8471 8000 00 0

Applications ● Artificial Intelligence ● Automotive ● AV Broadcasting ● Deep learning ● Digital Signal Processing ● 5G Wireless and Wire Communication ● Data Centers ● Drive / Motion Control ● Industrial Internet of Thing ● Cloud Computing Security ● Machine Vision ● Medical Endoscop ● Video and Image Processing