Alinx Electronic Limited
AX7350B Dev Board & Kit with AMD Zynq 7000 SoC XC7Z035
The AX7350B SoC development board equipped with the AMD Zynq 7000 SoC-series device with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, SFP+, FMC LPC, Gigabit Ethernet, applied to Industrial, Medical, Automotive, Video and Image Processing, Control & Instrumentation and Communication, etc.
Référence de l’article: VAR-827002853
Numéro de produit du fabricant: AX7350B
Code douane: 8471 8000 00 0
Article situé / expédié de : Riedlingen, Allemagne
Product Description
The AX7350B SoC development board equipped with the AMD/Xilinx Zynq 7000 SoC-series XC7Z035 device, delivers standout performance with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, SFP+, FMC LPC, Gigabit Ethernet.
Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (SFP+).
Applications
Automotive
● Road Sign Recognition
● ADAS
● Smart Transportation
Communication Network
● Ethernet Backhaul
● Small Cell Baseband
● Network Switch
● Flexible radio platform
Industrial
● Motor control
● Industrial Control
● Industrial IoT
● Instrumentation
● Smart Grid
Video and Image Processing
● Professional Cameras
● Computer Vision
● Machine Vision
Medical
● Endoscop
● Ultrasound, CT, MRI
Key Features
- ● AMD/Xilinx Zynq 7000 SoC:
◆ ARM dual-core Cortex-A9 up to 800 MHz
◆ Xilinx Kintex 7 28nm FPGA fabric● 1 GByte (32-bit) DDR3 SDRAM on PS
● 1 GByte (32-bit) DDR3 SDRAM on PL
● 32 MB QSPI Flash
● 8 GB eMMC Flash
● 1 x FMC LPC (FMC has 34 pairs lvds io and 1 pairs GTX)
● 1 x USB to UART on PS
● 2 x Gigabit Ethernet (1 x PS + 1 x PL) - ● 4 x USB2.0 (Host)
● 1 x HDMI out
● 2 x SFP+ (per line 10Gbos)
● 1 x PCIe Gen2 × 4 (PL)
● 1 x Micro SD
● LED (1 x PWR + 1 x DONE + 1 x RxD + 1 x TxD + PS LED + 4 x PL LED)
● KEY (1 x PS RST + 1 x PS KEY + 4 x PS KEY)
● 12V single supply
● Dimensions: 220 x 125 mm form factor
ID de l’art. | 102413 |
État | |
Modèle | AX7350B |
Fabricant | Alinx Electronic Limited |
Pays de fabrication | Chine |
Contenu | 1 pièce |
Poids | 1500 g |
Poids net | 1300 g |
Board Features
Featuring the AMD/Xilinx Zynq 7000 SoC XC7Z035-2FFG676I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq 7000 SoC based application.
What's Inside the Box
ALINX AMD Xilinx Zynq 7000 SoC XC7Z035 development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA and SoC devices – it is low-profile and covers the whole XC7Z035 device surface.
Development Board | 1 | Heatsink Kit (preinstalled) | 1 |
---|---|---|---|
Mini USB Cable | 2 | Transparent protective board | 1 |
12V Power Adapter | 1 | Card Reader | 1 |
TF Card | 1 |
Product Matrix
Product Model | Preferred Model | Zynq 7000 SoC | DDR3 SDRAM (PS) | DDR3 SDRAM (PL) | QSPI Flash | eMMC | USD Price | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AX7350B | √ | XC7Z035-2FFG676I | 1 GB | 1 GB | 32 MB | 8GB | 687 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.