Product Description
The ACU19EG System-on-Chip (SoC) System-on-Module (SoM) combines high-end AMD/Xilinx Zynq UltraScale+ MPSoC-series XCZU19EG device with fast DDR4 SDRAM, eMMC Flash, dual parallel Quad-SPI Flash and thus forms a complete and powerful embedded processing system. This module is suitable for high-speed applications due to the high number of transceivers.
Applications
● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing
Key Features
- ● AMD/Xilinx Zynq Ultrascale+ MPSoC:
◆ ARM quad-core Cortex-A53 up to 1.3 GHz
◆ ARM dual-core Cortex-R5 up to 533 MHz
◆ Mali-400MP2 GPU
◆ 16nm FinFET+ FPGA fabric● Pluggable module with 8 x Panasonic board-to-board connectors
● 5 GByte (72-bit) DDR4 SDRAM with ECC on PS
● 4 GByte (64-bit) DDR4 SDRAM on PL
● 2 x 64 MB QSPI Flash
● 32 GB eMMC Flash
● PCIe Gen3 ×16 (PL), PCIe Gen2 ×4 (PS) - ● Gigabit transceivers
◆ 4 x GTR, up to 6 Gbps
◆ 32 x GTH, up to 12.5 Gbps
◆ 16 x GTY, up to 28.21 Gbps● User I/Os
◆ 54 PS MIOs
◆ 336 FPGA I/Os (96 HD + 240 HP)● EEPROM: 4-Kbit I2C Serial EEPROM
● Work temperature range of -40°C to +85°C
● 12V single supply
● Dimensions: 80 x 80 mm form factor
Module Features
Featuring the AMD/Xilinx Zynq UltraScale+ MPSoC XCZU19EG-2FFVC1760I
* If you want to design a base board based on this Zynq UltraScale+ MPSoC System-on-Module, you need to purchase AXK6A2337YG high-speed Board to Board Connectors, 120 Pins, you also need to purchase FAN8080 Heatsink Kit, the FAN8080 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
* We have Zynq UltraScale+ MPSoC development boards Z19-P that uses this Zynq UltraScale+ MPSoC module, to get started with development straight out of the box.
Please check the Relevant Products at the bottom of the page and click to learn more details.
Module Architecture
Click on the image to view a larger image.
Not all features are available simultaneously – please check the documentation for any applicable constraints.
All specifications are subject to change without notice. Please verify component specifications with vendor's datasheets.
ALINX provides product user manuals for each product.
What's Inside the Box
ALINX AMD Xilinx Zynq UltraScale+ MPSoC XCZU19EG System-on-Module/SoM
| MPSoC SoM | 1 |
|---|
Product Matrix
| Product Model | Preferred Model | MPSoC | DDR4 ECC SDRAM (PS) | DDR4 SDRAM (PL) | QSPI Flash | eMMC | GTH | GTY | Temp. Range | USD Price |
|---|---|---|---|---|---|---|---|---|---|---|
| ACU11EG | XCZU11EG-2FFVC1760I | 4 GB | 4 GB | 2 x 64 MB | 32GB | 32 | 16 | -40°C~+85°C | TBD | |
| ACU17EG | XCZU17EG-2FFVC1760I | 4 GB | 4 GB | 2 x 64 MB | 32GB | 32 | 16 | -40°C~+85°C | TBD | |
| ACU19EG | √ | XCZU19EG-2FFVC1760I | 5 GB | 4 GB | 2 x 64 MB | 32GB | 32 | 16 | -40°C~+85°C | 3962 |
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
