Alinx Electronic Limited
AXKU3 FPGA Dev Board & Kit with AMD Kintex™ US+ XCKU3P
The AXKU3 FPGA development board equipped with the AMD Kintex UltraScale+ series device, delivers standout performance with DDR4 SDRAM, QSPI Flash, PCIe, FMC HPC, Gigabit Ethernet.
Numero di variazione (MEPA): VAR-827002804
Codice produttore: AXKU3
Codice doganale: 8471 8000 00 0
Articolo situato in e spedito da: Riedlingen, Germania
Product Description
The AXKU5/AXKU3 FPGA development board equipped with the AMD/Xilinx Kintex Ultrascale+-series device, delivers standout performance with fast DDR4 SDRAM, QSPI Flash, PCIe, FMC HPC, Gigabit Ethernet.
Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provide high-speed communication (PCIe).
Applications
● PON Access
● Mobile Backhaul
● Data Center Network Acceleration
Key Features
System-on-Module
● AMD/Xilinx Kintex Ultrascale+:
◆ 16nm FinFET FPGA fabric
◆ Up to 60% reduction in power consumption compared to 7 Series FPGAs
◆ More than 2x faster system-level performance per watt compared to Kintex 7 FPGAs
● Pluggable module with 2 x Samtec board-to-board connectors
● 2 GByte (32-bit) DDR4 SDRAM
● 2 x 32 MB QSPI FlashBase Board
● FMC HPC (34 pairs lvds ios + 8 pairs GTH)
● 1 x PCIe Gen3 ×8
● 1 x Gigabit Ethernet
● 1 x UART (USB to UART)
● 1 x 4 lane MIPI
● 1 x MicroSD
● 1 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
● LED (1 x PWR + 1 x RXD + 1 x TXD + 4 x LED) KEY(4 x KEY)
● 12V single supply
● Dimensions: 215 x 111 mm form factor
ID articolo | 102364 |
Condizione | |
Modello | AXKU3 |
Produttore | Alinx Electronic Limited |
Paese di produzione | |
Contenuto | 1 undefined |
Peso | 1500 g |
Peso netto | 1300 g |
Board Features
Featuring the AMD/Xilinx Kintex Ultrascale+ XCKU3P-2FFVB676I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+ based application.
* The AXKU3 development board consists of a ACKU3 SoM and base board. If you want to purchase ACKU3 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Kintex Ultrascale+ XCKU3P FPGA development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCKU3P device surface.
System-on-Module | 1 | Base Board | 1 |
---|---|---|---|
Mini USB Cable | 1 | USB Downloader Cable / set | 1 |
12V Power Adapter | 1 | PCle Fence | 1 |
Heatsink Kit (preinstalled) | 1 |
Product Matrix
1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.